The Bondexpo trade fair in Stuttgart

Bondexpo Stuttgart: The trade fair for industrial bonding technology

Bondexpo in Stuttgart is a renowned trade fair that specializes in industrial bonding technologies and joining techniques. It is the central meeting place for experts from the fields of bonding, sealing, potting and foaming. The trade fair covers the entire value chain, from the development and production of materials to application and process optimization. Companies from all over the world use Bondexpo to present their innovative products and services to a specialist audience.

Innovation and technology leadership at Bondexpo

Bondexpo is regarded as the leading platform for the exchange of knowledge and technologies in bonding technology. Experts meet here to find out about the latest developments in the industry and to find solutions to current challenges. The trade fair offers a unique opportunity to make contacts, initiate cooperations and exchange information on future-oriented technologies. With its wide range of exhibitors and a varied supporting program, Bondexpo is an essential event for everyone involved in bonding and joining technology. Further information can be found on the organizer's website: www.bondexpo-messe.de