Bondexpo Stuttgart – The international trade fair for adhesive technology

Connectivity solutions for tomorrow's industrial production

Bondexpo in Stuttgart is the leading trade fair for industrial bonding, joining, and fastening technologies in German-speaking countries—and far beyond. Held in parallel with Motek, the leading trade fair for production and assembly automation, Bondexpo attracts thousands of trade visitors and numerous exhibitors from all over the world every year who rely on high-precision, durable, and sustainable joining technologies in their respective industries. In the age of lightweight construction, electromobility, digitalization, and individualization, industrial bonding has long since become a key technology – wherever screws, rivets, or welding reach their limits. Bondexpo provides a platform for this development and shows that adhesives and their application are much more than just an “add-on” – they are drivers of innovation and an integral part of modern manufacturing.

Connection technology at the highest level

The trade fair presents a comprehensive range of products and services along the entire value chain:

• Industrial adhesives for metal, plastic, glass, textiles, or composite materials
• Hybrid adhesives, UV- or heat-curing systems
• 1K/2K systems, structural and temporary adhesives
• Special solutions for automotive engineering, aerospace, electronics, and medical technology
• Application technology: dosing, mixing, application – manual, semi-automatic, or fully automatic
• Robotic and inline systems for automated adhesive application
• Surface treatment such as plasma, corona, or laser activation
• Monitoring & quality assurance: camera systems, sensor technology, process control
• Sustainable and bio-based adhesives
• Adhesive tapes, sealants, potting compounds
• Services, certifications, standardization

If you are interested in other trade fairs in the region, you will find a comprehensive overview of the regional event portfolio at Stuttgart Trade Fair.

Relevant across industries – for almost every sector

Bondexpo appeals to a diverse target group, as adhesive technology can be used in almost all branches of industry—and is increasingly becoming the preferred bonding solution in these sectors. The trade fair is aimed in particular at:

• Design engineers and developers
• Production and manufacturing managers
• Process engineers
• Materials experts
• Quality assurance specialists
• Procurement and purchasing specialists
• Technical service providers and automation specialists
• Research institutions and universities

Particularly in the context of lightweight construction, composite materials, miniaturization, or flexible production lines, modern adhesive systems are often the only realistic option for reconciling functional, aesthetic, and economic requirements.

Special areas, live demonstrations, and expert talks

Bondexpo is particularly valued for its high practical relevance: numerous exhibitors demonstrate live how automated bonding works in production lines. Examples include:

• Robotic cells with application units
• Real-time mixing systems
• Automatic web tracking and material application
• Inline inspections with AI-supported evaluation
• Temperature- and humidity-controlled bonding processes

The trade fair also offers a compact expert forum where specialists discuss trends such as “predictive bonding,” “digital twins in joining technology,” and “recyclable bonding.” These formats provide concrete knowledge transfer that can be directly applied in development and production departments.

Sustainability and innovation as drivers

Sustainable manufacturing is also a key driver in adhesive technology: the focus is on solvent-free systems, resource-saving dosing technology, bio-based adhesives, and removable bonds for product recycling. Bondexpo shows how modern bonding processes can be embedded in the circular economy and eco-design—without compromising on quality or strength. At the same time, topics such as smart adhesives (e.g., with temperature-controlled properties), 3D bonding applications, and digitally networked application systems are becoming increasingly important.

Bondexpo + Motek: A perfect combination

One of the major advantages is that it is held at the same time and in the same place as the Motek automation trade fair. Visitors not only gain access to the world of adhesive bonding technology, but also to the latest developments in assembly, robotics, and production technology—a real added value for integrated solutions in mechanical engineering or series production.

Bondexpo – the meeting place for the joining technology of the future

In an industrial world where lightweight construction, customization, and sustainability set the pace, joining solutions are needed that are as flexible as they are powerful. Bondexpo offers a highly specialized, technically focused platform where precisely these solutions can be experienced live, compared, and further developed. Further information can be found on the organizer's website: www.bondexpo-messe.de